Interconnection structure and manufacturing method thereof

ABSTRACT

An interconnection structure includes a first dielectric layer, a first conductor, an etch stop layer, and a second dielectric layer. The first conductor is partially in the first dielectric layer and having a portion protruding from the first dielectric layer. The etch stop layer is on the first dielectric layer and covering the protruding portion of the first conductor. The second dielectric layer is on the etch stop layer. A bottom surface of the second dielectric layer has a portion in a position lower than a top of the first conductor.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. patent application Ser. No.15/379,461, filed Dec. 14, 2016, which is a continuation of U.S. patentapplication Ser. No. 14/850,848, filed Sep. 10, 2015, now U.S. Pat. No.9,780,025, issued Oct. 3, 2017, which claims priority to U.S.Provisional Application Ser. No. 62/098,184, filed Dec. 30, 2014, all ofwhich are herein incorporated by reference in their entireties.

BACKGROUND

The word “interconnection” in very large-scale integrated circuits(VLSIs) means a metal line which connects the various electronicdevices. The interconnecting metal lines are separated from thesubstrate by insulating layers, except on the contact area. Since thecreation of the integrated circuit (IC) in 1960, aluminum (Al) or itsalloy has become the primary material for interconnecting metal lines,and silicon dioxide has become the primary material for insulatinglayers.

Copper-based chips are semiconductor integrated circuits, usuallymicroprocessors, which use copper for interconnections. Since copper isa better conductor than aluminum, chips using this technology can havesmaller metal components, and use less energy to pass electricitythrough them. Together, these effects lead to higher-performanceprocessors.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-13 are cross-sectional views of an interconnection structure atvarious stages in accordance with some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Reference is made to FIG. 1. A first dielectric layer 110 is formed on asubstrate. The first dielectric layer 110 is an interlayer dielectric(ILD) layer. The first dielectric layer 110 is made of a dielectricmaterial, such as silicon oxide, silicon nitride, silicon oxynitride, orcombinations thereof. In some embodiments, the first dielectric layer110 is made of a low-κ dielectric material to improveresistive-capacitive (RC) delay. The dielectric constant of the low-κdielectric material is lower than that of silicon dioxide (SiO₂). Oneapproach to reduce the dielectric constant of a dielectric material isto introduce carbon (C) or fluorine (F) atoms. For example, in SiO₂(K=3.9), the introduction of C atoms to form hydrogenated carbon-dopedsilicon oxide (SiCOH) (κ is between 2.7 and 3.3) and the introduction ofF atoms to form fluorosilicate glass (FSG) (κ is between 3.5 and 3.9)reduces its dielectric constant. Another approach to reduce thedielectric constant of a dielectric material is by introducing an airgap or pores. Since the dielectric constant of air is 1, the dielectricconstant of a dielectric film can be reduced by increasing the porosityof the dielectric film. In some embodiments, the low-κ dielectricmaterial is, for example, porous silicon oxide (i.e. the xerogel or theaerogel), nanopore carbon doped oxide (CDO), black diamond (BD), abenzocyclobutene (BCB) based polymer, an aromatic (hydrocarbon)thermosetting polymer (ATP), hydrogen silsesquioxane (HSQ), methylsilsesquioxane (MSQ), poly-arylene ethers (PAE), diamond-like carbon(DLC) doped with nitrogen, or combinations thereof. The first dielectriclayer 110 is formed by, for example, chemical vapor deposition (CVD),spin coating, or combinations thereof. The first dielectric layer 110has a thickness in a range from about 400 Å to about 600 Å.

Reference is made to FIG. 2. At least one first hole 112 and at leastone second hole 114 are formed in the first dielectric layer 110. Thefirst and second holes 112 and 114 are formed by a photolithography andetching process. The photolithography and etching process includesphotoresist application, exposure, developing, etching, and photoresistremoval. A photoresist is applied onto the first dielectric layer 110by, for example, spin coating. The photoresist is then prebaked to driveoff excess photoresist solvent. After prebaking, the photoresist isexposed to a pattern of intense light.

The intense light is, for example, a G-line with a wavelength of about436 nm, an I-line with a wavelength of about 365 nm, a krypton fluoride(KrF) excimer laser with a wavelength of about 248 nm, an argon fluoride(ArF) excimer laser with a wavelength of about 193 nm, a fluoride (F₂)excimer laser with a wavelength of about 157 nm, or combinationsthereof. A space between the final lens of the exposure tool and thephotoresist surface may be filled with a liquid medium that has arefractive index greater than one during the exposure to enhance thephotolithography resolution. The exposure to light causes a chemicalchange that allows some of the photoresist soluble in a photographicdeveloper.

Then, a post-exposure bake (PEB) may be performed before developing tohelp reduce standing wave phenomena caused by the destructive andconstructive interference patterns of the incident light. Thephotographic developer is then applied onto the photoresist to removethe some of the photoresist soluble in the photographic developer. Theremaining photoresist is then hard-baked to solidify the remainingphotoresist.

Portions of the first dielectric layer 110 which are not protected bythe remaining photoresist are etched to form the first and second holes112 and 114. The etching of the first dielectric layer 110 may be dryetching, such as reactive ion etching (RIE), plasma enhanced (PE)etching, or inductively coupled plasma (ICP) etching. In someembodiments, when the first dielectric layer 110 is made of siliconoxide, fluorine-based RIE can be used to form the first and second holes112 and 114. The gas etchant used to dry etch the first dielectric layer110 is, for example, CF₄/O₂, ClF₃, CCl₃F₅, SF₄/O₂, or combinationsthereof.

After the first and second holes 112 and 114 are formed, the photoresistis removed from the first dielectric layer 110 by, for example, plasmaashing, stripping, or combinations thereof. Plasma ashing uses a plasmasource to generate a monatomic reactive species, such as oxygen orfluorine. The reactive species combines with the photoresist to form ashwhich is removed with a vacuum pump. Stripping uses a photoresiststripper, such as acetone or a phenol solvent, to remove the photoresistfrom the first dielectric layer 110.

Reference is made to FIG. 3. A first barrier layer 120 is formed onsidewalls and bottom surfaces of the first and second holes 112 and 114.In FIG. 3, the first barrier layer 120 is further formed on a topsurface of the first dielectric layer 110. The first barrier layer 120is made of a material which can adhere conductors in the first andsecond holes 112 and 114 to the first dielectric layer 110 and can stopdiffusion of the conductors into the first dielectric layer 110. In someembodiments, when the conductors in the first and second holes 112 and114 are made of copper (Cu), the first barrier layer 120 is made of, forexample, tantalum nitride (TaN), tantalum (Ta)/TaN, Ta, other transitionmetal based materials, or combinations thereof. In some otherembodiments, when the conductors in the first and second holes 112 and114 are made of aluminum, the first barrier layer 120 is made of, forexample, titanium nitride (TiN), titanium (Ti)/TiN, Ti, other transitionmetal based materials, or combinations thereof. The first barrier layer120 is formed by, for example, physical vapor deposition (PVD), ionizedphysical vapor deposition (IPVD), atomic layer deposition (ALD),chemical vapor deposition (CVD), or combinations thereof.

Reference is made to FIG. 4. A first electrically conductive material130 overfills the first and second holes 112 and 114. The firstelectrically conductive material 130 is made of metal, such as copper(Cu), aluminum (Al), tungsten (W), nickel (Ni), cobalt (Co), titanium(Ti), platinum (Pt), tantalum (Ta), or combinations thereof. The firstelectrically conductive material 130 is formed by, for example,electrochemical deposition, physical vapor deposition (PVD), chemicalvapor deposition (CVD), or combinations thereof.

Reference is made to FIG. 5. The excess first electrically conductivematerial 130 and first barrier layer 120 outside of the first and secondholes 112 and 114 are removed through a removal process. In someembodiments, the first electrically conductive material 130 and thefirst barrier layer 120 over burden are removed by a chemical mechanicalpolishing (CMP) process. In some embodiments, when the firstelectrically conductive material 130 is made of copper (Cu), the CMPslurry is made of, for example, a mixture of suspended abrasiveparticles, an oxidizer, and a corrosion inhibitor, and the CMP slurry isacidic. A two-step CMP process may be used to remove the excess firstelectrically conductive material 130 and first barrier layer 120. In thefirst step, the abrasive will remove the bulk first electricallyconductive material 130 without disturbing the first barrier layer 120.In the second step, the residual first electrically conductive material130 and the first barrier layer 120 will be removed using silicaabrasive. After the CMP process, a first bottom conductor 132 is formedin the first hole 112, and a second bottom conductor 134 is formed inthe second hole 114.

Reference is made to FIG. 6. The first dielectric layer 110 is etchedback. The first and second bottom conductors 132 and 134 have higheretch resistance to the etching back than that of the first dielectriclayer 110. Therefore, the first bottom conductor 132 has a portionprotruding from the top surface of the first dielectric layer 110, andthe second bottom conductor 134 has a portion protruding from the topsurface of the first dielectric layer 110 as well. The etching back ofthe first dielectric layer 110 may be dry etching, such as reactive ionetching (RIE), plasma enhanced (PE) etching, or inductively coupledplasma (ICP) etching. In some embodiments, fluorine-based RIE can beused to etch back the first dielectric layer 110. The gas etchant usedto etch back the first dielectric layer 110 is, for example, CF₄/O₂,ClF₃, CCl₃F₅, SF₄/O₂, or combinations thereof. In some embodiments, theetching back of the first dielectric layer 110 has an etching depth in arange from about 25 Å to about 275 Å.

Reference is made to FIG. 7. An etch stop layer 140 is formed on thefirst dielectric layer 110 and the protruding portions of the first andsecond bottom conductors 132 and 134.

Reference is made to FIG. 8. A second dielectric layer 150 is formed onthe etch stop layer 140. The second dielectric layer 150 is aninterlayer dielectric (ILD) layer as well. The second dielectric layer150 is made of a dielectric material, such as silicon oxide, siliconnitride, silicon oxynitride, or combinations thereof. In someembodiments, the second dielectric layer 150 is made of a low-κdielectric material, such as hydrogenated carbon-doped silicon oxide(SiCOH), fluorosilicate glass (FSG), porous silicon oxide (i.e. thexerogel or the aerogel), nanopore carbon doped oxide (CDO), blackdiamond (BD), a benzocyclobutene (BCB) based polymer, an aromatic(hydrocarbon) thermosetting polymer (ATP), hydrogen silsesquioxane(HSQ), methyl silsesquioxane (MSQ), poly-arylene ethers (PAE),diamond-like carbon (DLC) doped with nitrogen, or combinations thereof.The second dielectric layer 150 is formed by, for example, chemicalvapor deposition (CVD), spin coating, or combinations thereof. Thesecond dielectric layer 150 has a thickness in a range from about 400 Åto about 600 Å.

Reference is made to FIG. 9. A third hole 152 is formed in the seconddielectric layer 150. The third hole 152 is formed by a photolithographyand etching process. The photolithography and etching process includesphotoresist application, exposure, developing, and etching. Aphotoresist is applied onto the second dielectric layer 150 by, forexample, spin coating. The photoresist is then prebaked to drive offexcess photoresist solvent. After prebaking, the photoresist is exposedto a pattern of intense light.

The intense light is, for example, a G-line with a wavelength of about436 nm, an I-line with a wavelength of about 365 nm, a krypton fluoride(KrF) excimer laser with a wavelength of about 248 nm, an argon fluoride(ArF) excimer laser with a wavelength of about 193 nm, a fluoride (F₂)excimer laser with a wavelength of about 157 nm, or combinationsthereof. A space between the final lens of the exposure tool and thephotoresist surface may be filled with a liquid medium that has arefractive index greater than one during the exposure to enhance thephotolithography resolution. The exposure to light causes a chemicalchange that allows some of the photoresist soluble in a photographicdeveloper.

Then, a post-exposure bake (PEB) may be performed before developing tohelp reduce standing wave phenomena caused by the destructive andconstructive interference patterns of the incident light. Thephotographic developer is then applied onto the photoresist to removethe some of the photoresist soluble in the photographic developer. Theremaining photoresist 155 is then hard-baked to solidify the remainingphotoresist 155.

At least one portion of the second dielectric layer 150 which is notprotected by the remaining photoresist 155 is etched to form the thirdhole 152. The etching of the second dielectric layer 150 may be dryetching, such as reactive ion etching (RIE), plasma enhanced (PE)etching, or inductively coupled plasma (ICP) etching. In someembodiments, when the second dielectric layer 150 is made of siliconoxide, fluorine-based RIE can be used to form the third hole 152, andthe gas etchant used to dry etch the second dielectric layer 150 is, forexample, CF₄/O₂, ClF₃, CCl₃F₅, SF₄/O₂, or combinations thereof.

The etch stop layer 140 and the second dielectric layer 150 havedifferent etch resistance properties. In some embodiments, the etch stoplayer 140 is made of a material which has higher etch resistance to theetchant used to etch the third hole 152 than that of the seconddielectric layer 150. Therefore, the etching of the second dielectriclayer 150 is stopped by the etch stop layer 140 without overetching thefirst dielectric layer 110. In some embodiments, when the seconddielectric layer 150 is made of silicon oxide, the etch stop layer 140is made of a carbon-rich material, such as silicon carbon nitride(SiCN). The etch stop layer 140 is formed by, for example,plasma-enhanced chemical vapor deposition (PECVD).

The etch stop layer 140 and the first dielectric layer 110 havedifferent etch resistance properties as well. In some embodiments, theetch stop layer 140 has higher etch resistance to the etchant used toetch the third hole 152 than that of the first dielectric layer 110.Therefore, even if the etching of the second dielectric layer 150overetches the etch stop layer 140, the overetching of the etch stoplayer 140 is slighter than the overetching of the first dielectric layer110 in absence of the etch stop layer 140. In some embodiments, when thefirst dielectric layer 110 is made of silicon oxide, the etch stop layer140 is made of a carbon-rich material, such as silicon carbon nitride(SiCN).

The etch stop layer 140 has a thickness in a range from about 50 Å toabout 300 Å. The etch stop layer 140 has raised portions R respectivelycovering the protruding portions of the first and second bottomconductors 132 and 134. At least one of the raised portions R has a cappart 142 and at least one spacer part 144. The cap part 142 covers a topsurface of the protruding portion of at least one of the first andsecond bottom conductors 132 and 134. The spacer part 144 is disposed onat least one sidewall of the protruding portion of at least one of thefirst and second bottom conductors 132 and 134. The spacer part 144 isthicker than the cap part 142. In some embodiments, the cap part 142 hasa thickness TC in a range from about 50 Å to about 500 Å, and the spacerpart 144 has a thickness TS in a range from about 150 Å to about 700 Å.

Reference is made to FIG. 10. At least one portion of the etch stoplayer 140 which is exposed by the third hole 152 is etched to form anopening 146. The opening 146 is in communication with the third hole152, and the protruding portion of the first bottom conductor 132 is atleast partially exposed by the opening 146. The etching of the etch stoplayer 140 may be dry etching, such as reactive ion etching (RIE), plasmaenhanced (PE) etching, or inductively coupled plasma (ICP) etching. Insome embodiments, when the etch stop layer 140 is made of silicon carbonnitride (SiCN), fluorine-based RIE can be used to form the opening 146,and the gas etchant of the RIE is, for example, C₂F₆, CF₄/O₂, CF₄/H₂,C₃F₈, or combinations thereof.

Since the spacer part 144 is thicker than the cap part 142, the etchingof the etch stop layer 140 can remove the cap part 142 to expose thefirst bottom conductor 132 while leave at least a portion of the spacerpart 144 on the first dielectric layer 110. That is, the etching theopening 146 is stopped before reaching the first dielectric layer 110,and thus the first dielectric layer 110 is not exposed by the opening146. In some embodiments, the opening 146 has a depth D in a range fromabout 0 Å to about 100 Å.

After the opening 146 is formed, the photoresist 155 is removed from thesecond dielectric layer 150 by, for example, plasma ashing, stripping,or combinations thereof. Plasma ashing uses a plasma source to generatea monatomic reactive species, such as oxygen or fluorine. The reactivespecies combines with the photoresist 155 to form ash which is removedwith a vacuum pump. Stripping uses a photoresist stripper, such asacetone or a phenol solvent, to remove the photoresist 155 from thesecond dielectric layer 150.

Reference is made to FIG. 11. A second barrier layer 160 is formed onsidewalls of the third hole 152 and sidewalls and a bottom surface ofthe opening 146. In FIG. 11, the second barrier layer 160 is furtherformed on a top surface of the second dielectric layer 150. Since theopening 146 has a low aspect ratio, the second barrier layer 160 can beformed in the opening 146 with at least acceptable step coverage. Thesecond barrier layer 160 is made of a material which can adhere aconductor in the third hole 152 and the opening 146 to the seconddielectric layer 150 and the etch stop layer 140 and stop diffusion ofthe conductor into the second dielectric layer 150 and the etch stoplayer 140. In some embodiments, when the conductor in the third hole 152and the opening 146 is made of copper (Cu), the second barrier layer 160is made of, for example, tantalum nitride (TaN), tantalum (Ta)/TaN, Ta,other transition metal based materials, or combinations thereof. In someother embodiments, when the conductor in the third hole 152 and theopening 146 is made of aluminum (Al), the second barrier layer 160 ismade of, for example, titanium nitride (TiN), titanium (Ti)/TiN, Ti,other transition metal based materials, or combinations thereof. Thesecond barrier layer 160 is formed by, for example, physical vapordeposition (PVD), ionized physical vapor deposition (IPVD), atomic layerdeposition (ALD), chemical vapor deposition (CVD), or combinationsthereof.

Reference is made to FIG. 12. A second electrically conductive material170 overfills the third hole 152 and the opening 146. The secondelectrically conductive material 170 is made of metal, such as copper(Cu), aluminum (Al), tungsten (W), nickel (Ni), cobalt (Co), titanium(Ti), platinum (Pt), tantalum (Ta), or combinations thereof. The secondelectrically conductive material 170 is form by, for example,electrochemical deposition, physical vapor deposition (PVD), chemicalvapor deposition (CVD), or combinations thereof.

Reference is made to FIG. 13. The excess second electrically conductivematerial 170 and second barrier layer 160 outside of the third hole 152and the opening 146 are removed through a removal process. In someembodiments, the second electrically conductive material 170 and secondbarrier layer 160 over burden are removed by a chemical mechanicalpolishing (CMP) process. In some embodiments, when the secondelectrically conductive material 170 is made of copper (Cu), the CMPslurry is made of, for example, a mixture of suspended abrasiveparticles, an oxidizer, and a corrosion inhibitor, and the CMP slurry isacidic. A two-step CMP process may be used to remove the excess secondelectrically conductive material 170 and second barrier layer 160. Inthe first step, the abrasive will remove the bulk second electricallyconductive material 170 without disturbing the second barrier layer 160.In the second step, the residual second electrically conductive material170 and the second barrier layer 160 will be removed using silicaabrasive. After the CMP process, a top conductor 172 is formed in thethird hole 152 and the opening 146, and the top conductor 172 iselectrically connected to the first bottom conductor 132.

In some embodiments, the first and second dielectric layers 110 and 150may be made of substantially the same material, and thus the etchingselectivity between the first and second dielectric layers 110 and 150is low. In such embodiments, if the etch stop layer 140 were not formedbetween the first and second dielectric layers 110 and 150, the etchingof the second dielectric layer 150 might overetch the first dielectriclayer 110 to from at least one recess in the first dielectric layer 110with a high aspect ratio. Since the aspect ratio of the recess is high,the second barrier layer 160 may not be formed in the recess withacceptable step coverage. Therefore, a pullback void may be formedbetween the top conductor 172 and the first bottom conductor 132 due toa following thermal process, such as baking.

In order to prevent the first dielectric layer 110 from beingoveretched, the etch stop layer 140 is formed between the first andsecond dielectric layers 110 and 150. The etch stop layer 140 has highetch resistance to the etching of the second dielectric layer 150.Therefore, the etching of the second dielectric layer 150 can be stoppedby the etch stop layer 140 without overetching the first dielectriclayer 110. Since the first dielectric layer 110 is not overetched toform the high aspect ratio recess, the second barrier layer 160 can beformed with at least acceptable step coverage to adhere the topconductor 172 to the second dielectric layer 150 and the etch stop layer140. Accordingly, a pullback void will not be formed between the topconductor 172 and the first bottom conductor 132 after a followingthermal process, such as baking.

According to some embodiments, an interconnection structure includes afirst dielectric layer, a first conductor, an etch stop layer, and asecond dielectric layer. The first conductor is partially in the firstdielectric layer and having a portion protruding from the firstdielectric layer. The etch stop layer is on the first dielectric layerand covering the protruding portion of the first conductor. The seconddielectric layer is on the etch stop layer. A bottom surface of thesecond dielectric layer has a portion in a position lower than a top ofthe first conductor.

In some embodiments, the interconnection structure further includes asecond conductor and a third conductor. The second conductor is at leastpartially in the first dielectric layer. The third conductor is in thesecond dielectric layer and electrically connected to the secondconductor.

In some embodiments, the interconnection structure further includes abarrier layer between the etch stop layer and the third conductor.

In some embodiments, the second conductor has a portion protruding fromthe first dielectric layer.

In some embodiments, the interconnection structure further includes abarrier layer over a sidewall of the protruding portion of the secondconductor.

In some embodiments, the etch stop layer has a raised portion coveringthe protruding portion of the first conductor.

In some embodiments, the raised portion has a cap part over a topsurface of the protruding portion of the first conductor and a spacerpart over a sidewall of the protruding portion of the first conductor,and the spacer part is thicker than the cap part.

According to some embodiments, an interconnection structure includes afirst dielectric layer, a first conductor, an etch stop layer, a seconddielectric layer, and a second conductor. The first conductor is atleast partially in the first dielectric layer. The etch stop layer is onthe first dielectric layer. The second dielectric layer is on the etchstop layer. An interface between the etch stop layer and the seconddielectric layer has a first portion in a first position lower than atop of the first conductor and a second portion in a second positionhigher than the top of the first conductor. The second conductor is inthe second dielectric layer and the etch stop layer and electricallyconnected to the first conductor.

In some embodiments, the second conductor tapers toward the firstconductor.

In some embodiments, the etch stop layer has a portion surrounding thefirst conductor, and said portion of the etch stop layer has a topsurface in a third position lower than the first position.

In some embodiments, the interconnection structure further includes abarrier layer contacting said portion of the etch stop layer.

In some embodiments, the interconnection structure further includes athird conductor at least partially in the first dielectric layer,wherein the etch stop layer covers the third conductor.

In some embodiments, the third conductor has a portion protruding fromthe first dielectric layer.

In some embodiments, the etch stop layer has a raised portionconformally over the protruding portion of the third conductor.

According to some embodiments, a method for manufacturing aninterconnection structure, the method comprising: etching a first holein a first dielectric layer; depositing a first conductor in the firsthole; etching back the first dielectric layer, such that the firstconductor has a portion protruding from the first dielectric layer;conformally depositing an etch stop layer on the first dielectric layerand the protruding portion of the first conductor; and depositing asecond dielectric layer on the etch stop layer.

In some embodiments, the method further includes etching a second holein the first dielectric layer; depositing a second conductor in thesecond hole, wherein conformally depositing the etch stop layercomprises conformally depositing a portion of the etch stop layer overthe second conductor; etching a third hole in the second dielectriclayer and the etch stop layer to expose the second conductor, whereinthe protruding portion of the first conductor is covered by the etchstop layer after etching the third hole; and depositing a thirdconductor in the third hole.

In some embodiments, etching the third hole is performed such that thethird hole tapers toward the second conductor.

In some embodiments, conformally depositing the etch stop layer isperformed such that the etch stop layer has a raised portion coveringthe protruding portion of the first conductor.

In some embodiments, the method further includes etching a second holein the second dielectric layer and the etch stop layer to expose thefirst conductor; and depositing a second conductor in the second hole.

In some embodiments, etching the second hole includes etching the etchstop layer to form a recess surrounding the first conductor. The methodfurther includes depositing a barrier layer to line the recess.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An interconnection structure, comprising: a firstdielectric layer; a first conductor partially in the first dielectriclayer and having a portion protruding from the first dielectric layer;an etch stop layer on the first dielectric layer and covering theprotruding portion of the first conductor; and a second dielectric layeron the etch stop layer, wherein a bottom surface of the seconddielectric layer has a portion in a position lower than a top of thefirst conductor.
 2. The interconnection structure of claim 1, furthercomprising: a second conductor at least partially in the firstdielectric layer; and a third conductor in the second dielectric layerand electrically connected to the second conductor.
 3. Theinterconnection structure of claim 2, further comprising: a barrierlayer between the etch stop layer and the third conductor.
 4. Theinterconnection structure of claim 2, wherein the second conductor has aportion protruding from the first dielectric layer.
 5. Theinterconnection structure of claim 4, further comprising: a barrierlayer over a sidewall of the protruding portion of the second conductor.6. The interconnection structure of claim 1, wherein the etch stop layerhas a raised portion covering the protruding portion of the firstconductor.
 7. The interconnection structure of claim 6, wherein theraised portion has a cap part over a top surface of the protrudingportion of the first conductor and a spacer part over a sidewall of theprotruding portion of the first conductor, and the spacer part isthicker than the cap part.
 8. An interconnection structure, comprising:a first dielectric layer; a first conductor at least partially in thefirst dielectric layer; an etch stop layer on the first dielectriclayer; a second dielectric layer on the etch stop layer, wherein aninterface between the etch stop layer and the second dielectric layerhas a first portion in a first position lower than a top of the firstconductor and a second portion in a second position higher than the topof the first conductor; and a second conductor in the second dielectriclayer and electrically connected to the first conductor.
 9. Theinterconnection structure of claim 8, wherein the second conductortapers toward the first conductor.
 10. The interconnection structure ofclaim 8, wherein the etch stop layer has a portion surrounding the firstconductor, and said portion of the etch stop layer has a top surface ina third position lower than the first position.
 11. The interconnectionstructure of claim 10, further comprising: a barrier layer contactingsaid portion of the etch stop layer.
 12. The interconnection structureof claim 8, further comprising: a third conductor at least partially inthe first dielectric layer, wherein the etch stop layer covers the thirdconductor.
 13. The interconnection structure of claim 12, wherein thethird conductor has a portion protruding from the first dielectriclayer.
 14. The interconnection structure of claim 13, wherein the etchstop layer has a raised portion conformally over the protruding portionof the third conductor.
 15. A method for manufacturing aninterconnection structure, the method comprising: etching a first holein a first dielectric layer; depositing a first conductor in the firsthole; etching back the first dielectric layer, such that the firstconductor has a portion protruding from the first dielectric layer;conformally depositing an etch stop layer on the first dielectric layerand the protruding portion of the first conductor; and depositing asecond dielectric layer on the etch stop layer.
 16. The method of claim15, further comprising: etching a second hole in the first dielectriclayer; depositing a second conductor in the second hole, whereinconformally depositing the etch stop layer comprises conformallydepositing a portion of the etch stop layer over the second conductor;etching a third hole in the second dielectric layer and the etch stoplayer to expose the second conductor, wherein the protruding portion ofthe first conductor is covered by the etch stop layer after etching thethird hole; and depositing a third conductor in the third hole.
 17. Themethod of claim 16, wherein etching the third hole is performed suchthat the third hole tapers toward the second conductor.
 18. The methodof claim 15, wherein conformally depositing the etch stop layer isperformed such that the etch stop layer has a raised portion coveringthe protruding portion of the first conductor.
 19. The method of claim15, further comprising: etching a second hole in the second dielectriclayer and the etch stop layer to expose the first conductor; anddepositing a second conductor in the second hole.
 20. The method ofclaim 19, wherein etching the second hole comprising etching the etchstop layer to form a recess surrounding the first conductor; and furthercomprising: depositing a barrier layer to line the recess.